Job Description

Technology Development (TD) is the heart and soul of Moore's Law at Intel. TD has helped Intel advance from the early days of semiconductor technology to the latest technologies that can pack more than 100 million transistors on a square millimeter of silicon. TD's more than 10,000 employees drive breakthrough research, develop next generation process and packaging technologies, while also running high volume manufacturing operations in its state-of-the-art facilities in Oregon and Arizona.

This position is responsible for supporting and executing on the Intel packaging foundry services marketing and strategic plan. In this role, you will have the opportunity to engage directly with Intel Foundry Service business development team in defining the target segments and customers and their related product package and assembly requirements and be a part of driving IDM 2.0 execution.

Responsibilities include:

• Analyzes competitive intelligence to make business conclusions for ATTD portfolio offerings for potential IFS customers and working with the ATTD competitive analysis team.
• Works across internal Intel groups (IFS, GSEM, SMG, etc) to drive and coordinate deals, tradeoffs, and external foundry business processes.
• Creates technical marketing materials to inform customers on our offerings and educate customers on ATTD's value proposition relative to competitors.
• Interacts with Intel investor relations groups as they relay our portfolio and value proposition to external investors.
• Frequently interacts and makes recommendations to Intel VPs and Corporate VPs and will need to be conversant and knowledgeable in both internal roadmaps and external industry trends.

The ideal candidate should demonstrate the following behavioral traits:

• Strong communication and presentation skills
• Strong organizational and planning skills
• Strong customer orientation and customer service experience is desired
• Willing to work with internal stakeholders and external customers

Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences .

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• BS, MS or PhD in an engineering discipline required
• 7+ years of experience in microelectronic packaging required
• 3+ years experience in OSAT-Semiconductor customer interface

Preferred Qualifications:

• Extensive knowledge of packaging disciplines as well as knowledge base in die prep, assembly, sort, and test technology and manufacturing
• Knowledgeable about semiconductor products and familiar with packaging trends and/or leading player package roadmaps
• Experience and interaction with leading Semiconductor players and their OSAT partners
• Ability to work independently in a highly matrixed structure.
• Experience presenting to Senior Management (VP and Corporate VP Level). Blend of both business and technical background.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Covid Statement

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html

Annual Salary Range for jobs which could be performed in US, Colorado, New York, Washington, California: $136,750.00-$232,630.00

• Salary range dependent on a number of factors including location and experience

Working Model

This role is available as a fully home-based and generally would require you to attend Intel sites only occasionally based on business need. This role may also be available as our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

JobType

Fully Remote